Stress related offset voltage shift in a precision operational amplifier

In molded DIP packaging die attach stresses and stresses due to the contraction of the molding compound lead to a complex state of stress on the die surface where active device elements are located. This paper summarizes experimentation to reduce the effects of packaging stresses upon offset voltage shift in a precision operational amplifier. Variables examined include circuit location, low stress mold compounds, silicone gel coatings, side braze versus molded DIP assembly and post assembly trim.<
>