Short-pulse propagation technique for characterizing resistive package interconnections

A novel technique for completely characterizing the frequency-dependent electrical properties of resistive transmission lines by short-pulse propagation is described. Time-domain measurements of the loss and dispersion of pulses propagated on two different lengths of the line under investigation, together with the measured low-frequency capacitance, are used to determine its broadband complex propagation constant and complex impedance. The technique is illustrated with measurements on a thin-film package interconnection structure. The measured line characteristics are used in a transient circuit analysis program to predict output waveforms generated by logic-like signals.<
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