Multichip module connector evaluation at Unisys

Unisys Corporation has been pursuing a course towards high pin count multichip modules (MCMs) for several years. The module development program includes an effort to evaluate and test the connectors required to interconnect these modules. Central to this effort is the Z-AXIS Interconnect Program, which concentrates on the pinless (or pad array) connectors. The studies and testing so far indicate that a Z-AXIS connector like the Fuzz Button is a viable approach for a pad array interconnection of an MCM. The flatness and structural requirements have been studied and determined to be manageable. Testing of buttons has demonstrated that initially buttons can be made to work. Related experience with button connections has been good.<
>