Chip on tape qualification and reliability

High-density and high-leadcount chip on tape (COT) technology is emerging as an attractive component for high-performance multichip module applications. A hermetic sealed semiconductor die with gold bump terminations over SiO/sub 2/ and Si/sub 3/N/sub 4/ passivations was bonded to a gold-plated copper tape, using a thermal compression gang bonding technique. The device was subsequently encapsulated and marked. The authors first review the bump design rules, bump characteristics, and the inner lead bond process. The reliability test results of COT devices are presented.<
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