Thin film surface mount fuses

The required characteristics for SMD (surface mounted device) fuses are small size, accurate current-sensing, very fast reaction (blow) time, and the ability to provide surge resistance (time lag fuses). It has been demonstrated that all these requirements are satisfied by the thin-film fuse. The thin-film technology provides a high level of control of all fuse parameters, thus accomplishing true and economical custom design capabilities to meet a wide range of fusing requirements. The photolithographic production method allows for a great variety of fuse element designs and substrate types to be combined for creating a wide range of fuse chips. This includes any size standard SMD chips and non-standard chips with a variety of electrical characteristics. Critical parameters such as fuse speed can be programmed to optimally satisfy application requirements. The hermetic structure of the thin-film fuse gives the device excellent environmental reliability.<
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