Automatic chip placement: one solution, user-benefits, and future development

The author explores generic chip placement challenges and assembly options. A specific commercial solution for automated die bonding in the microelectronics marketplace, namely the MRSI-501 automated die placement system is described. The placement accuracy is +or-0.002 to 0.003 in and two degrees in theta. However, the same system places flip chips to within +or-0.0015 in. The system's throughput rate is 400-450 die per hour for vision-guided placements and 900 die per hour for direct pick and place. Developments in chip placement systems, including ultraprecision placement, are discussed.<
>