The design of ES/9000 module

The technology enhancements appearing in the glass ceramic TCM (thermal conduction module) of the ES/9000 systems are described and related to the system performance requirements. This module is larger, holds more circuits, supports higher power chips, and has more and faster signal connections than any of its predecessors. To assure the operational integrity of this module, much attention was paid to its electrical design. The interconnection and noise rules were carefully generated through extensive modeling and circuit simulation. Sophisticated design tools were generated to keep track of the noise and estimate the delay on each and every path in the TCM. A comprehensive set of measurements on specially built test vehicles measured in specialized testers was used to confirm the accuracy of the modules and rules. As a result, the TCM can support more functions and faster cycle times at a better quality level.<
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