In-situ measurement of impedance of die power delivery system

The modified method of measurement of impedance of die power delivery system is presented. In contrast to the previous approach, the proposed methodology includes a new method of detailed reconstruction of the on-chip current for a step-wise computer process. The new methodology is based on representation of a chip as a variable resistor. The measurement results show the most pronounced difference between the new and previous methodologies in the frequency regions of power delivery resonances. The difference is higher for chips with higher Q-factors.