In-situ micro-digital image speckle correlation technique for characterization of materials' properties and verification of numerical models

In this study, improved cross-search, bicubic spline interpolation and finite element (FE) methods are implemented into conventional digital image speckle correlation algorithm in order to reduce correlation computational time, to increase deformation measurement accuracy, and to smooth deformation distribution. With the improved correlation algorithms, an integrated computer-aided-measurement system, called micro-digital image speckle correlation (/spl mu/-DiSC) is built. This system is then applied to characterize the thermal property and fracture behavior of the plastic ball grid array (BGA) assembly and underfill thin film, and employed to validate the material constitutive relationship for a flip chip package and the fatigue life prediction model for a BGA assembly. The demonstration results are found to be in good agreement with those obtained from thermo-mechanical analyzer (TMA), finite element modeling (FEM), moire/spl acute/ interferometry (MI), and accelerated temperature cycling (ATC) test. Therefore, the system can be used as an effective experimental tool to characterize properties of electronic materials and verify findings of theoretical and numerical models for the establishment of reliability design methodology.