A novel highly heat-resistant substrate material for halogen-free applications

A novel halogen-free laminate for IC package substrate has been developed, based on molecular-level designing of polymer networks. Utilization of high-LOI (limiting oxygen index) resin constituents contributes to enhance flame resistance of the resin itself and to lower the content of metal hydrate as flame retardant. In this paper, we compared the properties of halogen-free laminates, especially those which influence significantly on the package reliability. The newly developed halogen-free laminate "BN300GF" has its glass transition temperature over 300/spl deg/C and shows superior resistance against beat and chemical treatment.