Lithography for sub-90nm applications

In order to cope with the progressive scaling of CMOS, new lithography techniques are introduced for sub-90nm applications. Among them are the introduction of the 157nm wavelength and extreme ultra-violet lithography (EUVL). However, the delay in availability of these tools requires the extension of 193nm lithography towards future technology nodes. This paper gives an overview of the latest breakthroughs and the remaining challenges to the lithography community.