Reactively Bonded Thin-Film Conductors, a New Component for Combination Thin- and Thick-Film Technology

A 'thin-film reactively bonded gold alloy has been developed. This material is similar in composition and physical properties to thick-film reactively bonded golds. It is a vacuum-deposited material that is fired in air at high temperatures (1000°C) to form a strong bond with ceramic substrates. Thin-film reactively bonded gold is a dense, smooth rhaterial with high electrical conductivity. This alloy can withstand repeated firings in the 850 to 1000° temperature range and is compatible with most thick-film materials including dielectrics, resistors and conductors. It can be ,easily etched into fine geometrics (very high yield with one-mil line and one-mil spaces), making it a good candidate for high density interconnect technology.