By Topic

Conductive adhesives for high-frequency applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)


Showing 1-15 of 15 Results
  1. M. Dernevik and P. Starski, "Applications of glued transitions at high frequencies", Proc. GigaHertz 95, 1995
  2. R. Sihlbom and J. Liu, "High frequency signal simulation of anisotropically conductive adhesive flip-chip joints", Proc. Latest Achievements Conductive Adhesive Joining Electronics Packaging, pp. 197-210, 1995
  3. Z. Lai and J. Liu, "Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates", IEEE Trans. Comp., Packag., Manufact. Technol., vol. 19, pp. 644-660, 1996
  4. M. Dernevik, R. Sihlbom, Z. Lai, P. Starski, and J. Liu, "High-frequency measurements and modeling of anisotropic electrically conductive adhesive flip-chip joint", Proc. Adv. Electron. Packag., pp. 177-184, 1997
  5. L. Li and J. E. Morris, "Electrical conduction models for isotropically conductive adhesive joints", Adhesives in Electronics, 1996
  6. B. L. Dillaman, S. M. Wentworth, and R. W. Johnson, "Attenuation and reliability of conductive adhesive interconnects", Electron. Packag. Conf., 1996
  7. t. c. Hal F. Brinson, Adhesives and Sealants, vol. 3, 1990, ASM
  8. K. X. Hu, C. P. Yeh, and K. W. Wyatt, "Electro-, thermo-mechanical responses of conductive adhesive materials", ASME Int. Mech. Eng. Congr. Exhibition, 1996
  9. L. Li, C. Lizzul, H. Kim, I. Sacolick, and J. E. Morris, "Electrical, structural and processing properties of electrically conductive adhesives", IEEE Trans. Comp., Packag., Manufact., Technol., vol. 16, pp. 843-851, 1993
  10. L. Li, Basic and applied studies of electrically conductive adhesives, pp. 213-214, 1995, State Univ. New York
  11. L. Li and J. E. Morris, "Electrical conduction models for isotropically conductive adhesive joints", Adhesives in Electronics, 1996
  12. J.-K. Lin, J. Drye, W. Lytle, T. Scharr, R. Subrahmanyan, and R. Sharma, "Conductive polymer bump interconnects", 46th Electron. Comp. Technol. Conf., 1996
  13. J. Liu, "On the failure mechanism of anisotropically conductive adhesive joints on copper metallization", Int. J. Adhes. Adhesives, vol. 16, pp. 285-287, 1996 [CrossRef] 
  14. P. Savolainen, Solder-filled anisotropic conductive adhesives in electronic interconnections, 1996, Dept. Mater. Sci. Eng., Helsinki Univ. Technology
  15. K. F. Schoch and A. L. Bennet, "Electrical evaluation of conductive adhesives (for PCB',s)", 17th IEEE Electric./Electron. Insulation Conf., 1985