In the last few years, a series of breakthrough innovations have been made to transform analog-intensive RF circuitry into digitally-intensive implementations. In Texas Instruments, this disruptive technology falls under the umbrella of a Digital RF Processor (DRP^TM) platform and enables to integrate almost all of cellular phone modem electronics into a single IC chip fabricated using nanoscale digital CMOS process. The first such single-chip mobile phone was sampled in December 2004 and is now in a mass- volume production targeting ultra low cost handsets for the Emerging Markets. The ultra low cost handsets typically support a single standard, GSM, and are mostly dual-band with occasional quad-band for world travel compatibility. As the Emerging Markets consumers get more sophisticated, there will be an increase in demand for more sophisticated phones with Third Generation (3G) modem interface, as well as wireless connectivity, such as Bluetooth, Wireless LAN, in addition to mobile digital TV and Global Positioning System (GPS). This presentation will also overview recent advances in digital RF architectures in more sophisticated wireless standards beyond GSM and EDGE.