This paper describes a leading-edge 0.18 /spl mu/m CMOS logic foundry technology. Very aggressive design rules and borderless contacts render a 4.4 /spl mu/m/sup 2/ embedded (synchronous cache) 6T SRAM cell demonstrated in a 1 Mb vehicle with very high yield. Robust dual-gate oxides were developed to support 1.5-2 V core logic as well as 3.3 V periphery (I/O) circuitry. Advanced modular core device technology using 32 /spl Aring/ oxides for 1.8-2 V operation and 27 /spl Aring/ oxides for 1.5-1.7 V applications support competitive high-performance (MPU/graphics) or low-standby power (mobile) applications. Transient-enhanced diffusion is effectively used in I/O devices to enhance hot-carrier lifetime. This is the first 0.18 /spl mu/m technology demonstrating a highly manufacturable 6 to 7 level low-k (HSQ)/AlCu interconnect system with tightest metal pitch (0.46 /spl mu/m M1 and 0.56 /spl mu/m at intermediate levels), as well as aggressive borderless and fully stacked vias without poisoning problems. AlCu/FSG and dual-damascene Cu/oxide interconnect options have also been proven with comparable SRAM yield to the AlCu/HSQ system.