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Process integration of 3D Si interposer with double-sided active chip attachments

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19 Author(s)
Pei-Jer Tzeng ; Electron. & Optoelectron. Res. Labs. (EOL), Ind. Technol. Res. Inst. (ITRI), Hsinchu, Taiwan ; Lau, J.H. ; Chau-Jie Zhan ; Yu-Chen Hsin
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