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Electrical investigation and reliability of 3D integration platform using Cu TSVs and micro-bumps with Cu/Sn-BCB hybrid bonding

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9 Author(s)
Yao-Jen Chang ; Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan ; Cheng-Ta Ko ; Zhi-Cheng Hsiao ; Cheng-Hao Chiang
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