By Topic

Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
3 Author(s)
Li Yang ; Department of Electrical and Electronic Engineering, The University of Nottingham, Nottingham, U.K. ; Pearl A. Agyakwa ; C. Mark Johnson