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Enhancements in resizing single crystalline silicon wafers up to 450 mm by using thermal laser separation

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6 Author(s)
Koitzsch, M. ; Fraunhofer Inst. for Integrated Syst. & Device Technol. (IISB), Erlangen, Germany ; Lewke, D. ; Schellenberger, M. ; Pfitzner, L.
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