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Thermal performance study of next generation fine-pitch chip-on-film (COF) packages — A numerical study

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7 Author(s)
De-Shin Liu ; Advanced Institute of Manufacturing for High-tech Innovations and Department of Mechanical Engineering, National Chung Cheng, University, Chia-Yi, Taiwan ; Shu-Shen Yeh ; Chieh-Jung Lu ; Chan-Wei Chang
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