Silicon diodes with large aspect ratio trenched microstructures, backfilled with 6LiF, show a dramatic increase in thermal neutron detection efficiency beyond that of conventional thin-film coated planar devices. Described in this work are advancements in the technology using detector stacking methods to increase thermal neutron detection efficiency, along with the current process to backfill 6LiF into the silicon microstructures. The highest detection efficiency realized thus far is over 42% intrinsic thermal neutron detection efficiency by device-stacking methods. The detectors operate as conformally diffused pn junction diodes each having 1 cm2 area. Two individual devices were mounted back-to-back with counting electronics coupling the detectors together into a single dual-detector device. The solid-state silicon device was operated at 3 V and utilized simple signal amplification and counting electronic components that have been adjusted from previous work for slow charge integration time. The intrinsic detection efficiency for normal-incident 0.0253 eV neutrons was found by calibrating against a 3He proportional counter.