A new microelectronics packaging technique, called Solid Logic Technology (SLT), utilizes silicon planar glass-encapsulated transistors and diodes, and graphic arts techniques for producing high-quality, passive components having tight tolerances. The result is a process permitting the low-cost realization of a variety of versatile, high-performance circuit modules. The salient features of SLT are described: the unique form of the semiconductor devices, the module fabrication process, and some performance results. In addition, insight is provided to the range of components that may be fabricated with this technology, i.e., inductors, capacitors and high-power transistors. Examples are shown of specific high-speed, high-density and complex circuit packages.
Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.