The hybrid miniaturization technique of applying active and passive components separately to a packaging substrate enables independent customization of components and minimizes stray capacitance between components. Manufacturing advantages result because all components can be pretested, and the critical component joining operation can be performed as a continuous operation. This paper describes IBM's Advanced Solid Logic Technology (ASLT) wherein the capabilities of hybrid circuit technology have been extended to produce a high-speed, high-density digital logic module compatible with automated production. Design considerations and assembly processes are detailed. A development of the power handling capability reviews the various thermal paths within the module.
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