Transient analysis of resistive transmission lines has always been difficult. The need for this type of analysis, however, did not become critical until high-density circuit packaging became commonplace. This paper discusses a method for the transient analysis of resistive lines. It does not require a large number of equivalent circuit elements, and yet it can be used to represent a resistive line to any desired accuracy.
Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.