The basic component of the new IBM Enterprise System/9000™ Type 9121 Model 320 processor is an air-cooled thermal conduction module (TCM). The fabrication of this module required the integration of new bipolar chips, CMOS SRAM chips, and ECL and DCS logic circuitry in a TCM that could dissipate heat by means of air cooling. The method and details of this process of integration are described and discussed.
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