In this letter, we report the fabrication and characterization of self-aligned double-gate MOSFETs with gate length down to 6 nm. Based on molecular bonding, the interest of this original process relies on the fact that, for the first time, technological options such as planar process, independently biasable gates, and metallic source and drain are integrated all together to address critical issues for sub-22-nm node, such as variability, short channel effect control, and access resistance decrease. Good electrical performance of pMOS transistors is demonstrated. Short channel effects are very well controlled down to 30 nm. The independent biasing of the two gates allows tuning of the characteristics, depending on the targeted applications.