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Copper wiring encapsulation at semi-global level to enhance wiring and dielectric reliabilities for next-generation technology nodes

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11 Author(s)
H. Kudo ; FUJITSU MICROELECTRONICS LIMITED, 1500 Mizono, Tado-cho, Kuwana-shi, Mie-ken, 511-0192, Japan ; M. Haneda ; T. Tabira ; M. Sunayama
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