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Thin-layer Au-Sn solder bonding process for wafer-level packaging, electrical interconnections and MEMS applications

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8 Author(s)
N. Belov ; Nanochip, Inc., 48041 Fremont Blvd., Fremont, California, USA, 94538 ; T. -K. Chou ; J. Heck ; K. Kornelsen
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