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Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology

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10 Author(s)
McNally, P.J. ; Microelectronics Group, Research Institute for Networks & Communications Engineering (RINCE), School of Electronic Engineering, Dublin City University, Dublin 9, Ireland ; Kanatharana, J. ; Toh, B.H.W. ; McNeill, D.W.
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