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Chemical mechanical polishing of shallow trench isolation using the ceria-based high selectivity slurry for sub-0.18 μm complementary metal–oxide–semiconductor fabrication

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5 Author(s)
Sam-Dong Kim ; Department of Electronic Engineering, Dongguk University, Seoul, Korea ; Hwang, In-Seok ; Hyung-Moo Park ; Jin-Koo Rhee
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