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click on this link:http://dx.doi.org/+10.1116/1.1379321
Heteroepitaxial cubic SiC thin films have been deposited on silicon substrates at temperatures in the range of 750–1000 °C using single molecular precursors by the metalorganic chemical vapor deposition (CVD) method. Single-crystalline, crack-free, stoichiometric cubic SiC films were successfully grown on both Si(001) and Si(111) substrates without surface carbonization at as low as temperature of 920 °C with 1,3-disilabutane, H3Si–CH2–SiH2–CH3, as a liquid single source precursor which contains silicon and carbon in 1:1 ratio. Cubic SiC thin films highly oriented in the  direction were also obtained on Si(001) using either a liquid mixture of 1,3,5-trisilapentane (TSP), H3Si–CH2–SiH2–CH2–SiH3, and 2,4,6-trisilaheptane (TSH) at 980 °C or 2,6-dimethyl-2,4,6-trisilaheptane (DMTSH), H3C–SiH(CH3)–CH2–SiH2–CH2–SiH(CH3)–CH3 at 950 °C without carrier gas. These growth temperatures were much lower than conventional CVD growth temperatures, and this is a report of cubic SiC film growth using the single molecular precursors of trisilaalkanes (i.e., DMTSH and TSP+TSH). The as-grown SiC films were characterized by in situ reflection high-energy electron diffraction and by ex situ x-ray diffrac- - tion, transmission electron diffraction, scanning electron microscopy, Auger electron spectroscopy, and Rutherford backscattering spectroscopy © 2001 American Vacuum Society.
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
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