By Topic

Very uniform and high aspect ratio anisotropy SiO2 etching process in magnetic neutral loop discharge plasma

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
7 Author(s)
Chen, W. ; ULVAC Japn Ltd., 2500 Hagisono, Chigasaki, Kanagawa 254-8543, Japan ; Morikawa, Y. ; Itoh, M. ; Hayashi, T.
more authors