Scheduled System Maintenance:
Some services will be unavailable Sunday, March 29th through Monday, March 30th. We apologize for the inconvenience.
By Topic

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
8 Author(s)
Chong, D.Y.R. ; United Test & Assembly Center Ltd., Singapore ; Lim, B.K. ; Rebibis, K.J. ; Pan, S.J.
more authors