By Topic

Thermo-mechanical Reliability Study of High I/Os Flip Chip On Laminated Substrate Based on FEA, RSM and Interfacial Fracture Mechanics

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Yingjun Cheng ; Shanghai Institute of Microsystem and Information Technology, The Chinese Academy of Science Address: No 865, Changning Road, Shanghai 200050, China E-mail: Phone: 021-62511070-5464 ; Gaowei Xu ; Dapeng Zhu ; Xiaoqin Lin
more authors