In this paper, we present and elaborate on die to wafer bonding technology with benzocyclobutene (BCB). This technology allows to fabricate a variety of reliable waferbonded components in a fairly simple way using only standard cleanroom equipment. We demonstrate the fabrication of passive devices such as microring resonators, as well as active components such as lasers and LEDs. We show good performance of these devices by presenting measurements of their characteristics. Furthermore, these devices were subjected to damp-heat testing, demonstrating the good quality of the BCB-bonding procedure. Finally, due to the low thermal conductivity of BCB, thermal management needs some attention. We present an analysis of the thermal problem and suggest a possible solution.