Contiguous-disk bubble devices are an approach to higher bit density through the use of coarse overlay patterns in manipulating small bubbles to relax device lithography requirements. As a first step towards such an objective, a fully processed chip using ion-implanted devices has been tested, showing the feasibility of all required memory functions with 5-μm bubbles and 25-μm period overlay patterns. A critique of permalloy versus implanted contiguous-disk devices is made, pointing out their basic difference in magnetization reversal processes and explaining the superiority of the latter over the former in achieving a good edge affinity of bubbles. The requirements for a good implanted device are reviewed, including the selection of garnet material parameters (K1, λ111), of implantation parameters (ion energy and dosage) and of device pattern geometry (thickness and shape of implanted layer). An understanding of these requirements has made it possible to demonstrate 1-μm bubble propagation in several contiguous-disk type circuits with 4.5-μm periods, yielding an areal density of over 3 × 107bit/in2made by conventional photolithography.