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Microwave Characterization of a Wafer-Level Packaging Approach for RF MEMS Devices Using Glass Frit Bonding

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4 Author(s)
Ilker Comart ; MEMS Res. & Applic. Center, Middle East Tech. Univ., Ankara, Turkey ; Kagan Topalli ; Simsek Demir ; Tayfun Akin

Author(s)

Ilker Comart
MEMS Res. & Applic. Center, Middle East Tech. Univ., Ankara, Turkey
Kagan Topalli ; Simsek Demir ; Tayfun Akin