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Low-Resistivity Long-Length Horizontal Carbon Nanotube Bundles for Interconnect Applications—Part II: Characterization

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5 Author(s)
Hong Li ; Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, Santa Barbara, CA, USA ; Wei Liu ; Cassell, A.M. ; Kreupl, F.
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Author(s)

Hong Li
Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, Santa Barbara, CA, USA
Wei Liu ; Cassell, A.M. ; Kreupl, F. ; Banerjee, K.