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Process integration of 3D Si interposer with double-sided active chip attachments

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19 Author(s)
Pei-Jer Tzeng ; Electronics and Optoelectronics Research Labs (EOL), Industrial Technology Research Institute (ITRI), Rm. 256, Bldg. 17, No. 195, Sec. 4, Chung-Hsing Road, Chutung, Hsinchu 310, Taiwan ; John H. Lau ; Chau-Jie Zhan ; Yu-Chen Hsin
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Author(s)

Pei-Jer Tzeng
Electronics and Optoelectronics Research Labs (EOL), Industrial Technology Research Institute (ITRI), Rm. 256, Bldg. 17, No. 195, Sec. 4, Chung-Hsing Road, Chutung, Hsinchu 310, Taiwan
John H. Lau ; Chau-Jie Zhan ; Yu-Chen Hsin ; Po-chih Chang ; Yiu-Hsiang Chang ; Jui-Chin Chen ; Shang-Chun Chen ; Chien-Ying Wu ; Ching-Kuan Lee ; Hsiang-Hung Chang ; Chun-Hsien Chien ; Cha-Hsin Lin ; Tzu-Kun Ku ; Ming-Jer Kao ; Ming Li ; Julia Cline ; Keisuke Saito ; Mandy Ji