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3D Integration technologies using self-assembly and electrostatic temporary multichip bonding

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7 Author(s)
Fukushima, T. ; New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan ; Hashiguchi, H. ; Bea, J. ; Murugesan, M.
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Author(s)

Fukushima, T.
New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan
Hashiguchi, H. ; Bea, J. ; Murugesan, M. ; Lee, K.-W. ; Tanaka, T. ; Koyanagi, M.