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A 247 µW 800 Mb/s/pin DLL-Based Data Self-Aligner for Through Silicon via (TSV) Interface

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4 Author(s)
Soo-Bin Lim ; Dept. of Nano-Semicond. Eng., Korea Univ., Seoul, South Korea ; Hyun-woo Lee ; Junyoung Song ; Chulwoo Kim

Author(s)

Soo-Bin Lim
Dept. of Nano-Semicond. Eng., Korea Univ., Seoul, South Korea
Hyun-woo Lee ; Junyoung Song ; Chulwoo Kim

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