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A new low-temperature bonding technology between large-area, high-power devices and Mo electrodes using Au-Al films

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4 Author(s)
Onuki, J. ; Res. Lab., Hitachi Ltd., Ibaraki, Japan ; Satou, M. ; Murakami, Susumu ; Yatsuo, T.

Author(s)

Onuki, J.
Res. Lab., Hitachi Ltd., Ibaraki, Japan
Satou, M. ; Murakami, Susumu ; Yatsuo, T.