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Thermal performance study of next generation fine-pitch chip-on-film (COF) packages — A numerical study

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7 Author(s)
De-Shin Liu ; Dept. of Mech. Eng., Nat. Chung Cheng Univ., Chia-Yi, Taiwan ; Shu-Shen Yeh ; Chieh-Jung Lu ; Chan-Wei Chang
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Author(s)

De-Shin Liu
Dept. of Mech. Eng., Nat. Chung Cheng Univ., Chia-Yi, Taiwan
Shu-Shen Yeh ; Chieh-Jung Lu ; Chan-Wei Chang ; Chen-Wei Hung ; An-Hong Liu ; Hung-Hsin Liu