InxGa1-xSb is an attractive candidate for high performance III-V p-metal-oxide-semiconductor field effect transistors (pMOSFETs) due to its high bulk hole mobility that can be further enhanced with the use of strain. We fabricate and study InxGa1-xSb-channel pMOSFETs with atomic layer deposition Al2O3 dielectric and self-aligned source/drain formed by ion implantation. The effects of strain and heterostructure design for enhancing transistor performance are studied systematically. Different amounts of biaxial compression are introduced during MBE growth, and the effect of uniaxial strain is studied using wafer-bending experiments. Both surface and buried channel MOSFET designs are investigated. Buried (surface) channel InxGa1-xSb pMOSFETs with peak hole mobility of 910 (620) cm2/Vs and subthreshold swing of 120 mV/decade are demonstrated. Pulsed I-V measurements and low-temperature I-V measurements are used to investigate the physics in transistor characteristics.