By Topic

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)
Er-Ping Li ; Department of Electromagnetics and Electronic System, Institute of High Performance Computing, Agency for Science Technology and Research (A*STAR), Singapore ; Xing-Chang Wei ; Andreas C. Cangellaris ; En-Xiao Liu
more authors

Author(s)

Er-Ping Li
Department of Electromagnetics and Electronic System, Institute of High Performance Computing, Agency for Science Technology and Research (A*STAR), Singapore
Xing-Chang Wei ; Andreas C. Cangellaris ; En-Xiao Liu ; Yao-Jiang Zhang ; Marcello D'Amore ; Joungho Kim ; Toshio Sudo