Single crystalline silicon were mechanically modified (TNL, Tribo nanolithography) under precise normal force control at the mN ~ Â¿N level using PCD tools as a nano tool. The machined patterns were measured under an atomic force microscope (AFM) to obtain the machining characteristics of the samples for each set of conditions. Then the samples were etched using aqueous solution to verify the etch characteristics of the machined surface. We used SEM, TEM, SIMS, and AFM to investigate the difference in etch characteristics and mechanical properties produced under various mechanical machining conditions. Our results showed that either protruding or depressed patterns could be generated on the scratched surface after chemical etching by controlling the normal load and the etching condition. In addition, the mask effect of brittle material after mechanical scratching was controlled by the conventional mechanical machining conditions such as contact area, chip formation, plastic flow, and material removal. Then, this study will be preceded to hybrid electrochemical nanolithography applications in near future.