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Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics

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2 Author(s)
Boping Wu ; Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA ; Leung Tsang

Author(s)

Boping Wu
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
Leung Tsang