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Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection

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4 Author(s)
Kiwon Lee ; Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea ; Hyoung-Joon Kim ; Myung-Jin Yim ; Kyung-Wook Paik

Author(s)

Kiwon Lee
Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
Hyoung-Joon Kim ; Myung-Jin Yim ; Kyung-Wook Paik