Carbon nanotubes (CNTs) are an attractive electrical interconnect material due to their excellent mechanical, electrical and thermal properties. Despite these advantages CNTs have not been widely adopted by industry primarily because of the difficulties associated with integrating CNTs into device electronics. In this paper we demonstrate that bundles of aligned CNTs can be extracted directly from a CNT film using solder ball grid arrays (BGA). The resulting CNT bundles adhere directly to the solder balls and show good vertical alignment. The affect of flux, CNT application displacement and solder ball phase (liquid or solid) on CNT bundle alignment and coverage area were examined. This simple process could be used to mechanically decouple the BGA from the substrate, reducing solder ball fatigue due to thermal cycling and increasing device reliability.