IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. For technical support, please contact us at firstname.lastname@example.org. We apologize for any inconvenience.
A new method is proposed for ferrite plating to overcome the disadvantages with the conventional ferrite plating based on the rotating disk method and spraying method. The ferrite film is grown in a stainless steel reaction cell, in which the reaction solution forms a "thin (~ 50 μm) liquid film" between a substrate and a cell wall. By intermittently introducing an oxidizing solution, which contains air as an oxidizing reagent, the metal ions (Fe2+, Co2+, etc) in the "liquid thin film" react into crystalline spinel film on the surface of the substrate. In the new method, oxygen concentration and the flow rate of the solution are much easier to control than in the previous method, and the reaction cell is much simpler too.